Integrated circuit fabrication

ABSTRACT

An integrated circuit and a process for making the same are provided. The circuit has a nitrogen implanted emitter window, wherein the nitrogen has been implanted into the emitter window after the emitter window etch, but prior to the emitter conductor deposition. Nitrogen implantation is expected to minimize oxide growth variation.

FIELD OF THE INVENTION

[0001] This invention relates, in general, to semiconductor integrated circuit technology and, in an illustrative embodiment, to integrated circuits that include bipolar or BiCMOS devices.

BACKGROUND OF THE INVENTION

[0002] Many modem integrated circuits utilize both bipolar and MOSFET (e.g., CMOS, NMOS, or PMOS) devices on a single chip. Such integrated circuits (when they combine bipolar and CMOS) are often termed “BiCMOS”. Fabrication of BiCMOS (or even BiNMOS or BiPMOS) integrated circuits poses special problems for the process designer because certain process steps (e.g., heating, deposition, etching, etc.) that may facilitate formation of bipolar devices may adversely effect formation of MOS devices.

[0003] One common problem with integrated circuit fabrication is the unwanted growth of oxide, specifically around window devices. Suppressing or suspending oxide growth around the window area should improve the uniformity of the wafers containing these devices. However, current means of suppressing or suspending oxide growth involve using low temperature (450° C.) during the wafer push into the furnace followed by high temperature (615° C.) for emitter poly deposition. These techniques are flawed in that they decrease wafer throughput and shorten furnace lifetimes.

[0004] Those concerned with the development of integrated circuit technology have consistently sought improved methods of integrated circuit fabrication. In order to increase throughput and uniformity, it is desirable to discover new methods of suppressing or suspending oxide growth during circuit fabrication.

SUMMARY OF THE INVENTION

[0005] Accordingly, the present invention provides an integrated circuit with a nitrogen implanted emitter window.

[0006] The present invention also provides a method of making an integrated circuit with minimal oxide growth wherein nitrogen is implanted into the emitter window after the emitter window etch, but prior to emitter conductor deposition.

DESCRIPTION OF THE DRAWINGS

[0007] FIGS. 1-8 are cross-sectional views of a partially fabricated integrated circuit formed according to illustrative embodiments of the present invention.

[0008] Turning to FIG. 1, reference numeral 11 denotes a substrate wherein features of the substrate, if present, are not shown.

[0009] In FIG. 2, a dielectric 16 is formed over the substrate.

[0010] In FIG. 3, a first conductor 17 is formed over the dielectric.

[0011] In FIG. 4, a patterned photoresist 18 is formed over conductor 17.

[0012] In FIG. 5, conductor 17 is removed to open a window 18 for an emitter device. FIG. 5 shows that part of dielectric 16 is removed when conductor 17 is removed.

[0013] In FIG. 6, nitrogen implantation, illustrated by perpendicular hatching 19, proceeds through the window formed in 18. The hatching 19 in FIG. 6 shows that nitrogen implantation occurs in dielectric 16 and an upper portion of substrate 11.

[0014] In FIG. 7, photoresist 18 is removed and the remaining dielectric is removed.

[0015] In FIG. 8, a second conductor 20 is formed over the exposed surface of the first conductor 17 and the substrate 11.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0016] It has been discovered that implanting nitrogen into the emitter window after the emitter window etch, but prior to emitter conductor deposition can minimize oxide growth variation. Consequently, the present invention provides a device with a window area wherein the oxide growth is suppressed or suspended. Suppressing or suspending oxide growth around the window area should improve the uniformity of the wafers containing these devices. The present invention also should extend poly furnace lifetimes as it avoids the known practice of using low temperature (450° C.) during the wafer push into the furnace followed by high temperature (615° C.) for emitter poly deposition.

[0017] The substrate, reference numeral 11 in FIG. 1, is typically, silicon, doped silicon, epitaxial silicon, etc. It may be assumed that appropriate field oxides or other isolation structures may have already been formed (although they are not shown). Such isolations may serve, for example, to separate n-wells and p-wells for NMOS and PMOS devices (in a BiCMOS circuit) and/or also to separate the subsequently formed bipolar devices.

[0018] Dielectric 16, which is formed over the substrate, is preferably an oxide of silicon. For example, dielectric 16 may be formed from TEOS or plasma enhanced TEOS (PETEOS). A thickness of about 1600 Å for dielectric 16 is preferable. One of ordinary skill in the art may choose other thicknesses for dielectric 16 depending upon the device being fabricated. For example, thicknesses of from 400, 500, 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500, 1600, 1700, 1800, 1900, to 2000 Å may be selected, preferably from 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500, to 1600 Å. Dielectric 16 may be partially etched by an anisotropic plasma etch. For example, if the initial thickness of dielectric 16 is approximately 1600 Å, then approximately 1000 Å of dielectric may be removed via etching, leaving approximately 600 Å of dielectric 16. The amount of dielectric removed will depend Up the device being fabricated.

[0019] Approximately 600 Å of conductor 17 is formed over dielectric 16. Other thicknesses of the first conductor 17 may also be chosen depending upon the device being fabricated. For example, thicknesses of from 300, 400, 500, 600, 700, 800, 900, to 1000 Å may be selected. First conductor 17 is preferably poly silicon or amorphous silicon.

[0020] A patterned photoresist 18 is formed over first conductor 17 by standard methods known to those of skill in the art. Then, the unmasked portion of the first conductor 17 is removed, preferable by dry etching, to open a window 18 for an emitter device. It is noted that this etching will usually remove part of the dielectric 16 as well as conductor 17.

[0021] Once the window is open, nitrogen implantation is effected through this window. Nitrogen implantation is conducted using standard methods known to those of skill in the art. The implantation occurs in the dielectric, and preferably in at least a part of the upper portion of the substrate (e.g., hatching 19 in FIG. 6).

[0022] After nitrogen implantation, photoresist 18 is removed. At this time, it is preferable to remove any remaining dielectric 16. This can be accomplished using standard means, such as a wet etch. As a result, the nitrogen-implanted window is located between the first conductor and dielectric layers.

[0023] Next, a second conductor 20 is formed over the exposed surface. Preferably, the exposed surface comprises the first conductor and the substrate. Second conductor 20 is preferably poly silicon or amorphous silicon. More preferably, the second conductor is poly silicon. Preferably about 1,800, 2,000, 2,200, 2400, 2,600, 2,800, 3,000, to 3,200, Å of second conductor are formed. More preferably, about 2,400 A of poly silicon are formed.

[0024] Conventional bipolar processing, BiCMOS processing, or both types of processing can take place at this point. Such conventional processing can include deposition of a dielectric, opening of windows in the dielectric, and deposition of conductive contacts.

[0025] Obviously, numerous modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the invention may be practiced otherwise that as specifically described herein. 

What is claimed is:
 1. An integrated circuit, comprising: a nitrogen implanted emitter window.
 2. An integrated circuit according to claim 1, wherein the nitrogen is implanted into the window after the emitter window etch and prior to emitter conductor deposition.
 3. An integrated circuit according to claim 1, wherein the circuit, further comprises: a substrate; a dielectric disposed over the substrate; a first conductor disposed over the dielectric; and, a second conductor disposed over the first conductor and part of the substrate.
 4. An integrated circuit according to claim 3, wherein the dielectric layer is from about 600 to 1600 Å.
 5. An integrated circuit according to claim 4, wherein the dielectric layer is formed from TEOS and is about 1600 Å.
 6. An integrated circuit according to claim 3, wherein the first conductor is from about 300 to 1000 Å.
 7. An integrated circuit according to claim 6, wherein the first conductor is poly silicon or amorphous silicon.
 8. An integrated circuit according to claim 7, wherein the first conductor is poly silicon and is about 600 Å.
 9. An integrated circuit according to claim 3, wherein the second conductor is from about 1800 to 3200 Å.
 10. An integrated circuit according to claim 9, wherein the second conductor is poly silicon or amorphous silicon.
 11. An integrated circuit according to claim 10, wherein the second conductor is poly silicon and is about 2400 Å.
 12. A method of forming an integrated circuit, comprising: implanting nitrogen into a window area prior to emitter conductor deposition.
 13. A method of forming an integrated circuit according to claim 12, wherein the circuit, further comprises: a substrate; a dielectric disposed over the substrate; a first conductor disposed over the dielectric; and, a second conductor disposed over the first conductor and part of the substrate.
 14. A method of forming an integrated circuit according to claim 13, further comprising: forming a dielectric layer over a substrate; forming a first conductor layer over the dielectric; forming a patterned resist over the first conductor layer; etching the first conductor layer, thereby forming a window; implanting nitrogen into the window area; removing the photoresist; and, forming a second conductor layer.
 15. A method of forming an integrated circuit according to claim 13, wherein removing, further comprises: removing the exposed dielectric layer.
 16. A method of forming an integrated circuit according to claim 13, wherein the dielectric layer is from about 600 to 1600 Å.
 17. A method of forming an integrated circuit according to claim 16, wherein the dielectric layer is formed from TEOS and is about 1600 Å.
 18. A method of forming an integrated circuit according to claim 13, wherein the first conductor is from about 300 to 1000 Å.
 19. A method of forming an integrated circuit according to claim 18, wherein the first conductor is poly silicon or amorphous silicon.
 20. A method of forming an integrated circuit according to claim 19, wherein the first conductor is poly silicon and is about 600 Å.
 21. A method of forming an integrated circuit according to claim 13, wherein the second conductor is from about 1800 to 3200 Å.
 22. A method of forming an integrated circuit according to claim 21, wherein the second conductor is poly silicon or amorphous silicon.
 23. A method of forming an integrated circuit according to claim 22, wherein the second conductor is poly silicon and is about 2400 Å. 